需求专业：
微电子、电子科学及技术、通信工程，电气自动化，材料,物理、材料科学与工程等相关专业
岗位职责：
• 负责工艺的整合改善和维护、产品良率的提升和品质的改善；
• 工艺流程的优化和技术开发；
• 产品电性能的测试分析；
• 其他。
Job description:
This contributor will work on the design and development of package solution for UHV GaN-on-Si power device / Co-package SiP and RF power amplifier device.
The job responsibilities include:
• Work with design, technology and applications engineering teams to design packaging
a)Power QFN/DFN, Flip chip and Cu Clip Packages and co-package Si control IC & GaN power FET SiP solution.
b)TSV process / plastic and ceramic packaging for RF power amplifier devices
• Design and co-work with third-party to implement thick RDL to improve performance and efficiency of power products.
• Develop thermal models to predict thermal behavior and verify simulation results with actual measurements.
• Interface closely with the company's design team and package suppliers to select the best technologies available. Communicate supplier ground rule and process capabilities to design engineering and marketing teams to assist in the selection of appropriate packaging on new programs.
• Maintain product quality while developing and introducing cost effective package solutions.
• Coordinate the introduction of new package assembly processes/materials into volume production.
• Perform package characterization and manufacturing studies to select the optimum process parameter for high assembly yields.
• Select and qualify new vendors and manufacturing suppliers to support quick turn assembly builds.
• Provide package applications support to customers and assist in answering Board/System level technical questions.
• Failure Analysis – participant and report.
Minimum Requirements:
• BS or above in Electronic Engineering, Engineering Physics or a related engineering degree.
• Minimum 5 years of experience on power and RF device packages.
Preferred Qualifications and Skills:
• Deep understanding of power and RF device packaging.
• Familiarity with analyzing mechanical & current distribution simulation results during package.
• Experience on GaN on Silicon power device packaging is preferred.
• Working knowledge of statistical process controls and failure analysis.
• Demonstrated ability to work within schedule constraints.
• Excellent communication and team skills.
• Technical documentation experience.
工作职责
1. 负责新建/扩建/改建工程的环境影响评价
2. 负责工业废水、废气、固废等三废处置
3. 负责危废的台账管理及系统管理计划、申报、转移联单管理
4. 负责法律法规收集及符合性评价工作
5. 负责制定公司的环保管理制度并监督落实执行
6. 负责员工的环保知识及事故案例培训
7. 负责环保处理设施运行监督检查
8. 负责废水、废气的例行监测管理
9. 负责环保税的申报管理工作
10. 负责VOCs产生工艺核查及系统申报工作
11. 负责应急预案的制定实施及申报备案工作
12. 负责ISO14001环保管理体系建立及推行
任职要求
1.大专及以上学历，持有安全管理员证书或注册安全工程师证者优先；
2.电气自动化、化学或化工或给排水相关专业；
3.有3-5年半导体、面板厂工作经验；
4.责任心强、办事高效；
5.对国家相关安全&健康&环保方面的法律法规较熟悉。
工作职责
独立负责弱电消防监控系统的运维工作。
职位要求
1.电力相关背景，大专及以上学历，有中级以上电工证优先；
2.有3年以上相关工作经验，半导体厂或电子厂背景更佳；
3.性格稳重、胆大心细、吃苦耐劳。
工作职责
1.确保电力设备的安全稳定运行，及时发现安全隐患，并提出整改方案；
2.编写电力设备的标准作业流程（SOP）;
3.对运行值班员进行电力设备标准作业流程（SOP）培训并组织考试；
4. 制定电力设备的日常维修保养计划和年度岁修计划；
5.定期监测电力设备的能耗状况，制定改善方案；
6.保持与供电公司的有效沟通，及时了解最新用电优惠政策;
7.制定电力供应中断紧急应变预案。
职位要求
1.要求大专以上文化水平，电力专业为主；
2.有中级以上电工证；
3.有3年以上半导体厂或电子厂相关工作经验；
4.性格稳重，胆大心细；
5.能吃苦耐劳。
工作职责
1.负责建设项目的水电安装工程方面的三控制、两管理、一协调等施工标准化管理工作；
2.负责与工程单位的协调沟通，保证按计划、保质量、成本受控地完成施工任务；
3.负责参与施工组织设计和施工技术方案的校对、审核工作；
4.负责参与招投标和设计交底、图纸会审工作；
5.负责施工现场的进度、质量和施工工艺的管理；
6.负责协调与施工单位、监理公司等工程各方的关系；
7.负责协助公司做好供应商的资质审查，甲供材料、物资供应落实等有关工作；
8.负责完成公司及项目部领导交办的其他工作。
职位要求
1.大专以上学历；
2.三年以上晶圆厂、面板厂相关工作经验。
工作职责
1. 确保全厂监控设备的安全稳定运行，及时发现安全隐患，并提出整改方案；
2. 编写监控系统的标准作业流程（SOP）;
3. 对运行值班员进行监控系统标准作业流程（SOP）培训并组织考试；
4. 制定监控设备的备品备件采购计划；
5. 制定监控设备的日常维修保养计划和年度岁修计划；
6. 制定厂务所有变频器、自控柜的日常维修保养计划和年度岁修计划。
职位要求
1. 大专以上学历；
2. 三年以上晶圆厂、面板厂相关工作经验。
Responsibilities:
• Characterization, ATE and probe data analysis
• Developing production and characterization test specifications
• Creating and managing product documentation
• Providing product development support which involves interfacing with Design, Test Engineering, Quality Engineering and others
• Driving cost reduction activities such as second sources qualification, yield enhancement, test time reduction, etc.
Job Requirements:
• Must have Bachelors Degree in Electrical Engineering with at least 5 years, or Masters EE Degree with 3 years.
• Highly prefer experience in semiconductor or similar electronics manufacturing environment.
• Candidate should have a good understanding of power device or IC parameters.
• Must possess strong data analysis skills and the ability to debug production and development issues, such as on ATE or bench characterization equipment.
• Team player, strong communication skills, ability to thrive in a fast-paced environment.
Job Description:
As a senior test engineer, you will lead the development and implementation of test equipment and test methods for Reliability Engineering of InnoScience GaN power semiconductor products. You will interact with device, reliability, application engineers and develop appropriate reliability test systems.
Essential Functions: Reliability / Systems Lab Test Development and Implementation：
• Design & build Reliability Lab test hardware and software using National Instruments hardware/software, discrete components, and test equipment.
• Build, operate and maintain in-house test equipment in areas such as wafer level, package level and system level reliability tests.
• Perform root cause analysis of failures identified during product development and reliability testing.
• Train/supervise technicians in conducting reliability testing.
Additional Responsibilities:
• Follow laboratory rules, procedures and guidelines.
• Attention to Safety.
Job Requirements:
• A good understanding in semiconductor technologies and reliability testing. Reliability engineering test experience desired.
• Experience in leading as well as installing, programming, and utilization of automated test equipment and data acquisition equipment, such as: NI LabView programming
• Experience with testing and validation methods, corrective action and in depth understanding of Product Reliability Test Standards
• Proficient using Microsoft Office applications and Windows.
• Language: CET4. CET6 or equivalent is preferred.
Education/Experience:
• BS/MS in microelectronics, electrical engineering or automation engineering. MS is preferred.
• 5 years/BS or 3 years/MS of engineering experience.
Attributes:
• Ability to work independently, make decisions and take risks.
• Willing to do anything to solve problems - nothing beneath her/him.
• Highly collaborative/responsive with internal resources, customers, etc.
• High level of accessibility.
• Good listening skills.
• Willing to engage in open, honest interactions and subordinate ego to get to action
• Results oriented; data driven.
岗位职责：
1．通过National Instruments软硬件平台，设计与建立氮化镓功率半导体器件可靠性测试系统。
2．建立、操作与维护硅片级、封装级、系统级可靠性测试平台。
职位要求：
1．微电子、电子工程专业毕业，硕士学历优先。
2．具有半导体测试/可靠性3~5年以上工作经验。
3．精通如何建立自动测试及数据采集系统，如通过National Instruments Labview编程。
4．能够根据需要设计测试设备的规格。
5．具备良好的沟通协调能力与团队合作精神。
6．具备流利的英语听说写能力。
Job Description:
As a senior reliability engineer you will be the key contributor driving reliability qualification of InnoScience GaN power semiconductor products. You will interact with design/marketing and develop an appropriate reliability qualification plan for our products, based on the core technology as well as the market it serves. You will develop test plans and procedures to calculate MTTF of our products. You will also be responsible for customer RMA FA.
Essential Functions:
• Lead device and package reliability qualifications for InnoScience power GaN power semiconductor products.
• Supervise technicians in conducting reliability testing.
• Drive qualification plans, schedules, meetings, reports, conference calls and communications with subcontractors.
• Work with internal or external subcontractors to design, develop and validate reliability stress hardware & software infrastructures.
• Coordinate debug and failure analysis of reliability failures and drive identification of root cause and corrective action.
• Perform advanced reliability modeling estimation across varying usage and operating life conditions.
• Support local customer RMA FA investigations.
Additional Responsibilities:
• Follow laboratory rules, procedures and guidelines.
• Attention to Safety.
Job Requirements:
• A good understanding in semiconductor technologies and processes of assembly, test, bumping and packaging.
• Familiar with failure modes and improvement techniques in device and package reliability testing, such as HTGB, HTRB, H3TRB, TC, IOL.
• Understanding of data and statistical analysis strongly desired.
• Experience in JEDEC qualification.
• Experience in automotive qualification is a plus.
• Experience in reliability testing in flip-chip, BGA or WLCSP packages is a plus.
• Language: CET4. CET6 or equivalent is preferred.
Education/Experience:
• BS/MS in microelectronics, electrical engineering or device physics. MS is preferred.
• 5 years/BS or 3 years/MS of hands on experience in reliability test in semiconductor industry.
Attributes:
• Ability to work independently, make decisions and take risks.
• Willing to do anything to solve problems - nothing beneath her/him.
• Highly collaborative/responsive with internal resources, customers, etc.
• High level of accessibility.
• Good listening skills.
• Willing to engage in open, honest interactions and subordinate ego to get to action.
• Results oriented; data driven.
岗位职责:
1．负责氮化镓功率半导体器件的可靠性测试。
2．负责公司内部及客户端失效样品的失效分析。
3．负责与内部或供应商协作建立可靠性测试系统。
职位要求：
1．微电子、电子工程、物理专业毕业，硕士学历优先。
2．具有半导体可靠性3~5年以上工作经验。
3．精通可靠性试验标准与方法，具有微组装、芯片失效分析能力。
4．熟悉常规可靠性测试项目的失效机理与改进方法，如HTGB、HTRB、H3TRB、TC、IOL。
5．能够根据需要设计测试设备的规格。
6．具备良好的沟通协调能力与团队合作精神。
7．可靠性理论扎实和有经验者优先。
8．具备流利的英语听说读写能力。
Responsibilities:
• Product, Technology modeling(IC & product building blocks)
Job Requirements:
• PhD & Master (985, 211)(Modeling )
• Related Work experience preferred
Responsibilities:
1. 协助设计工程师完成功率器件芯片版图规划与布局；
2. 优化layout设计，满足设计指标要求。
Job Requirements:
1. 计算机、微电子、电路与系统等相关专业本科、硕士；
2. 熟悉集成电路工艺流程，具有基本模拟电路，器件和信号匹配的基础知识；
3. 照设计工程师的要求设计芯片版图；
4. 练使用L-edit， Cadence Virtuoso等EDA工具进行版图设计，完成物理验证LVS等；
5. 功率器件或模拟电路layout设计及成功流片经历。
Job description:
This contributor will work on the design, test and characterization of active and passive devices using GaN HEMT technology. The job responsibilities include:
• Design of discrete and MMIC GaN based transistors for high power amplifier application. Passive components - capacitor and inductor design.
• Mask layout design and tapeout implementation .
• Plan, coordinate and evaluate process experiments (including DOE’s).
• Process flow design and setup and co-work with process engineers to fabricate this design.
• Device characterization including DC and dynamic analysis, s-parameter, large signal, load-pull to optimize device design.
• Identify potential performance, manufacturing, testing, and reliability concerns and opportunities for improvement.
Minimum Requirements:
• MS or PhD in Electronic Engineering, Engineering Physics or a related engineering degree
• Practice experience of 3 years on RF devices
Preferred Qualifications and Skills:
• Deep understanding of GaN RF device physics.
• Experience on GaN on Silicon device design, fabrication and characterization.
• Working experience with microwave test equipment (e.g. VNAs) and standard device characterization/de-embedding techniques and large-signal load-pull measurement.
• Experience on HFSS electromagnetic modeling software and ADS non-linear circuit simulators.
• Demonstrated ability to work within schedule constraints.
• Excellent communication and team skills.
Job description:
This contributor will work on the development and implementation of GaN monolithic power integrated circuit. The job responsibilities include:
• Ability to build a preliminary PDK for GaN monolithic IC design.
• Design & execute GaN IC functional blocks for power applications.
• Co-work with device / process engineers to fabricate this design.
• Design and build test systems to functionally characterize GaN ICs.
• Analyze device data and test structures to optimize device design.
• Identify potential performance, manufacturing, testing, and reliability concerns and opportunities for improvement.
Minimum Requirements:
• MS or PhD in Electronic Engineering, Engineering Physics or a related engineering degree.
• Minimum 2 years of experience on power IC design.
Preferred Qualifications and Skills:
• Familiarize the whole picture of design and fabricate power IC.
• Deep understanding of power IC design.
• Experience on GaN power product is preferred.
• Expertise in power IC and device characterization.
• Demonstrated ability to work within schedule constraints.
• Excellent communication and team skills.
• Technical documentation experience.
Job description:
This contributor will work on the design, test and characterization of power devices fabricated on GaN-on-Si HEMT technology. The job responsibilities include:
• Design of GaN semiconductor products for power applications.
• Mask layout design and tapeout implementation.
• Process flow design and setup and co-work with process engineers for device fabrication.
• Plan, coordinate and evaluate process experiments (including DOE’s).
• Device characterization including DC and dynamic analysis to optimize device design.
• Identify potential performance, manufacturing, testing, and reliability concerns and opportunities for improvement.
Minimum Requirements:
• MS or PhD in Electronic Engineering, Engineering Physics or a related engineering degree.
• Practice Experience on power devices.
Preferred Qualifications and Skills:
• Deep understanding of power device physics.
• Experience on power device design, fabrication and characterization.
• Working experience with keysight B1505 and B1500 measurement platforms.
• Experience on device TCAD simulators.
• Demonstrated ability to work within schedule constraints.
• Excellent communication and team skills.
• Technical documentation experience.
Responsibilities:
• Wafer defect inspection procedure setting and optimization, inspection result analysis, defect abnormal analysis/report, tracking the progress of continuous improvement of defects to improve product yield.
Job Requirements:
• Strong understanding of inline defect detection and failure analysis techniques.
• Experience on KLA inspection equipment or defect review tools (AMAT, KLA, Rudolph, etc.) in a high-volume manufacturing environment.
• Track record of driving high-impact yield improvement projects to completion.
• Familiar with 8D and FA method.
• Strong knowledge and experience of wafer processes.
• BS in Electrical, Mechanical, Chemical, Chemistry, Material Science or related engineering degree.
• 3~5 years of related experience.
• Experience GaN on Silicon process development.
Responsibilities:
• Responsible for the introduction of new products, trial production arrangement, production guidance, on-site abnormal problems in a timely manner to eliminate (abnormal immediately have temporary countermeasures).
• Maintaining or creating detailed documentation of product/process information including lessons learned, module characterizations, risk assessment, etc.
Job Requirements:
• Solid knowledge of semiconductor device physics, GaN electrical operation, and Probe/Test flow.
• Understanding of CMOS devices and semiconductor processing.
• Knowledge and experience with creating experiments using DOE, monitoring progress of changes, and using statistical methods to perform data analysis.
• Knowledge and experience with statistical process control (SPC).
• Knowledge of Failure Modes and Effects Analysis (FMEA).
• Understanding of wafer and package level process reliability.
• BS in Electrical, Mechanical, Chemical, Chemistry, Material Science or related engineering degree.
• 3~5 years of related experience.
• Experience building devices with GaN on Silicon.
Responsibilities:
• Responsible for the introduction of new products, trial production arrangement, production guidance, on-site abnormal problems in a timely manner to eliminate (abnormal immediately have temporary countermeasures).
• Maintaining or creating detailed documentation of product/process information including lessons learned, module characterizations, risk assessment, etc.
Job Requirements:
• Solid knowledge of semiconductor device physics, GaN electrical operation, and Probe/Test flow.
• Understanding of CMOS devices and semiconductor processing.
• Knowledge and experience with creating experiments using DOE, monitoring progress of changes, and using statistical methods to perform data analysis.
• Knowledge and experience with statistical process control (SPC).
• Knowledge of Failure Modes and Effects Analysis (FMEA).
• Understanding of wafer and package level process reliability.
• BS in Electrical, Mechanical, Chemical, Chemistry, Material Science or related engineering degree.
• 3~5 years of related experience.
• Experience building devices with GaN on Silicon.
Responsibilities:
• CMP process start-up & trouble-shooting.
• CMP process development.
Job Requirements:
• Chemistry / materials science / Semiconductor background.
• 3-5yr CMP process experience in semiconductor industry.
Responsibilities:
• Wet etch/clean process start-up & trouble-shooting.
• Wet etch/clean process development.
Job Requirements:
• Chemistry and materials science background.
• 3-5 yr work experience in semiconductor industry.
Responsibilities:
• ETCH process start-up & trouble-shooting.
• ETCH process development.
Job Requirements:
• Chemistry and materials science background.
• >3yr ETCH process experience in semiconductor industry.
Responsibilities:
• Furnace/implantor process start-up & trouble-shooting.
• Furnace/implantor process development.
Job Requirements:
• Chemistry and materials science background.
• >3 yr work experience in semiconductor industry.
Responsibilities:
• PVD/IMP process start-up & trouble-shooting.
• PVD/IMP process development.
Job Requirements:
• Semiconductor/materials science/physics background.
• >3 years experiences in process development or maintenance for PVD, familiar with related process and measurement equipment operation and recipe editing.
Responsibilities:
• CVD/PVD process start-up & trouble-shooting.
• CVD/PVD process development.
Job Requirements:
• Semiconductor and materials science background.
• Fresh or 1-3 yr work experience in semiconductor industry.
Responsibilities:
• MOCVD process start-up & trouble-shooting.
• MOCVD process development.
Job Requirements:
• Semiconductor/materials science/physical/eletrical background.
• (Al)GaN EPI background and familiar with GaN EPI theory .
• Master or PhD, thesis related to GaN EPI process or >3yr work experience in GaN based EPI industry.
• Familiar with Aixtron tool better.
岗位要求：
1、全日制统招大专及本科学历学位，英文CET-4或以上；
2、电气自动化、化学或化工或给排水相关专业；
3、主动、积极、能吃苦且按时完成交代的工作；
4、具有3-5年半导体或面板厂纯水系统或废水处理系统的建设或运行管理工作经验；
岗位职责：
1、负责新建纯水系统或废水处理系统期间的设计深化审核、材料及设备审核(含厂验)及监造管理；
2、保证公司生产所需的纯水系统供应废水系统处理达标排放；
3、纯水系统、废水系统设备运行、维护，管理及成本控制及异常处理；
4、负责制定纯废水系统相关SOP，并进行培训；
5、关注系统内备品备件损耗状况，并及时提出申购要求，100%满足系统的备件需要；
6、负责体系文件编制和执行情况监督；
7、负责节能降耗、持续改善；
8、上级领导交办的其他工作事项；
9、其它与气体系统有关的工作,如安全生产6S,气体HOOK UP 建设,文件建立和管理等；
10、熟悉办公软件EXCLE/WORD/PPT/CAD；
岗位职责：
1、在项目经理领导下，负责项目全过程的安全管理工作;
2、参与项目计划编制过程中的安全管理策划，编制项目安全管理计划;
3、参与工程项目劳动安全健康预评价和安全验收评价;
4、指导和检查项目安全、消防设计等专业的工作;
5、调试考核阶段安全管理职责;
6、收集整理项目安全管理文件和资料，办理归档手续;
7、编写项目安全管理总结;
岗位要求：
1、建筑工程、安全、环工、化工等工科专业大专以上学历；
2、具有3年以上半导体或面板厂的建筑与机电设备安装施工现场安全管理工作经验；
3、熟悉工地安全、文明施工管理流程以及能够根据工程项目特点进行危险源的辨别，有较强的现场安全管理和协调经验；
4、熟悉国家及当地各项安全法律法规，熟悉施工现场安全工作流程、安全操作规范和安全管理程序，能够及时发现安全隐患并给予纠正;
5、熟练掌握建筑施工生产过程及安全防护等相关安全规章、标准和日常安全管理，有高度的责任心。具有一定的沟通、组织、协调能力，较强的语言表达能力和书面表达能力；
6、熟悉安全数据的编制，熟悉安全类现场工作及内业表格；了解一体化管理体系；
7、有安全员证及安全从业资格证优先 ;
岗位要求：
1、全日制统招大专及本科学历学位，英文CET-4或以上；
2、电气自动化、自控或电力相关专业；
3、主动、积极、能吃苦且按时完成交代的工作；
4、具有3-5年半导体或光伏或面板厂相关工作经验；
岗位职责：
1、负责新建电力(高低压、发电机及UPS)系统及弱电消防监控系统期间的设计深化审核、材料及设备审核(含厂验)及监造管理；
2、保证公司生产所需电压日常运行及稳定；
3、电气电压系统设备运行、维护，管理及成本控制及异常处理；
4、负责制定电气系统相关SOP，并进行培训 ；
5、关注系统内备品备件损耗状况，并及时提出申购要求，100%满足系统的备件需要；
6、负责体系文件编制和执行情况监督；
7、负责节能降耗、持续改善；
8、其它与电力系统有关的工作,如安全生产6S,HOOK UP 建设,文件建立和管理等；
9、上级领导交办的其他工作事项；
10、熟悉办公软件EXCLE/WORD/PPT/CAD；
岗位要求：
1、全日制统招大专及本科学历学位，英文CET-4或以上；
2、化学或化工相关专业；
3、主动、积极、能吃苦且按时完成交代的工作；
4、具有3-5年半导体或面板厂特气或化学品系统的建设或运行管理工作经验；
岗位职责：
1、负责新建特气或化学品系统期间的设计深化审核、材料及设备审核(含厂验)及监造管理；
2、负责气体化学品系统的运行，维护，管理；
3、 负责气体化学品巡检，保养表单的制定；
4、 负责制定气体化学品应急预案，并定期进行演练；
5、 负责制定气体化学品相关SOP，并进行培训；
6、 负责备品备件的管理，制定备品备件安全库存；
7、 负责气体现场库存，确保钢瓶正常更换；
8、其它与气体系统有关的工作,如安全生产6S,气体HOOK UP 建设,文件建立和管理等；
9、上级领导交办的其他工作事项；
10、熟悉办公软件EXCLE/WORD/PPT/CAD；
岗位要求：
1、全日制统招大专及本科学历学位，英文CET-4或以上；
2、暖通或机电相关专业；
3、主动、积极、能吃苦且按时完成交代的工作.
4、具有3-5年半导体或光伏或面板厂的暖通和洁净系统的建设或运行管理工作经验
岗位职责：
1、负责新建暖通和洁净系统期间的设计深化审核、材料及设备审核(含厂验)及监造管理；
2、负责暖通和洁净系统的运行，维护，管理；
3、负责暖通和洁净系统的巡检，保养表单的制定；
4、负责制定暖通和洁净应急预案，并定期进行演练；
5、负责制定暖通和洁净相关SOP，并进行培训；
6、负责备品备件的管理，制定备品备件安全库存；
7、负责暖通和洁净现场库存，确保最低库存；
8、其它与暖通洁净系统有关的工作,如安全生产6S,HOOK UP 建设,文件建立和管理等
9、上级领导交办的其他工作事项；
10、熟悉办公软件EXCLE/WORD/PPT/CAD
岗位职责：
1、制定主生产计划，确保设备的最大利用率，满足客户需求。
2、制定和优化晶圆启动计划，以保持在制品的合理水平；
3、与各个部门沟通，跟踪生产进度；根据日常实际生产更新总计划，并向管理层反馈；
4、在WIP中设定生产批次的优先级，以满足不断变化的客户需求；
5、制定合理的总体设备效率目标，进行产能分析和评估，
6、跟踪在线产品流片，分析产品交期delay数据。
岗位要求：
1、大专以上学历，具有3年以上半导体生产相关经验，对各个生产区域设备熟悉，英语读、写熟练；
2、熟悉半导体行业工艺制作；对MES操作系统熟练应用；
3、有较好的Excel、PPT制作能力，使用VBA宏来增强和自动化任务的能力更佳；
4、具备良好的数据分析、处理能力以及良好的沟通协调能力。
岗位职责：
1、设备的到货、验收、付款情况的跟进，编制设备明细表；
2、工程项目的管理，付款的审核，发票的跟进，编制工程付款情况明细表；
3、固定资产卡片的录入，凭证的编制，固定资产的管理，出具每月相关财务报表及管理报表；
4、协助有关部门定期对固定资产进行盘点；
5、与业务相关财务报表的填制，协助审计业务开展，协助给银行等外部机构提供相关资料；
6、完成上级指派的其他工作。
岗位要求：
1、本科及以上学历，财务管理、会计、审计或经济类相关专业；
2、三年以上相同岗位工作经验，掌握全面的财会知识，并有凭证、报表等实操经验；
3、了解制造业财务核算流程，有半导体行业经验优先；
4、熟练操作财务软件及office办公自动化；
5、具备较强的人际交往能力、沟通协调能力、责任心，工作积极主动；
岗位职责：
1、应收账款的入账及对账工作；
2、销售统计分析数据及应收账款账龄分析；对应收款项及时催收结算，对确实无法收回的应收款项提出处理建议；
3、做好销售价格档案的审核及销售系统销售价格审核；销售报表编制的及时性和准确性；
4、依据公司相关制度，对公司各部门报销的费用进行审核，并出具会计凭证；出具每月财务报表及管理报表；
5、费用预提与摊销（工资薪金、社保、摊销等）；
6、及时主动督促有关单位、个人清还欠款，并向上级及时汇报工作情况；
7、与业务相关财务报表的填制，协助审计业务开展；
8、完成上级指派的其他工作；
岗位要求：
1、本科及以上学历，财务管理、会计、审计或经济类相关专业；
2、熟练操作与应用财务系统以及Office软件Excel, PPT, Word 等；
3、熟悉国家财经相关政策和会计制度准则；
4、2-3年以上应付账款或总帐会计工作经验，半导体行业相关的会计经验优先；
5、良好的职业道德和团队协作精神；
